Samsung
Electronics will use its single-chip solutions for its next smartphone,
the Galaxy S III, to lower dependence on U.S. chipmaker Qualcomm.
The
move comes as Samsung, the world’s top memory chipmaker, aggressively
shifting focus to more profitable and less-volatile non-memory chips.
Memory chips like DRAMs and NAND flashes are used to read and write data with these chips being commoditized.
Thus
they are cheap, compared with non-memory chips. Non-memories are to
control an entire computing system and require advanced chip-making
technology.
``Samsung’s
single-chip solution is a combination of long-term evolution (LTE),
telecommunications and W-CDMA functions,’’ a high-ranking company
executive said Monday.
The firm’s Exynos-branded
quad-core mobile application processors (APs) are to be equipped in the
Galaxy S II’s successor, according to the executive.
``We don’t think there will be
big technology-related problems as we have already tested our
telecommunications chips in some smartphones and tablets for consumers
in North America. Also, Google’s first reference mobile, the Galaxy
Nexus, is using Samsung's telecom chips,’’ said the executive.
``Samsung has a stronger intent
to lower its dependence on Qualcomm and our technicians believe that we
have made significant progress in producing logic-based chips for
high-end devices, combined logic and memory chips for graphic
controllers and core communication chips for Internet-enabled consumer
devices,’’ said the executive.
Amid the explosive growth for
LTE-enabled smartphones globally, the decision could hurt San
Diego-based Qualcomm in the mid- to long-term, according to analysts.
``Samsung is paying huge amounts
to Qualcomm in return for using its single-chip solutions in strategic
digital devices, however, Qualcomm is gradually losing its edge,’’ said
another Samsung executive. Both executives asked not to be identified as
they don’t have the right to officially speak to the media.
Samsung, which was the world’s
biggest smartphone seller last year, plans to sell 250 million
smartphones this year, up 25 percent from its earlier target of 200
million.
Ambitious Samsung, uneasy Qualcomm
So far, Samsung Electronics is
an earnings propeller for Qualcomm because the American firm was the
sole provider of one-chip solutions.
``It was believed that Qualcomm
chips had greater stability and suited easy upgrades. But, that’s the
old story,’’ said the Samsung executives.
In line with its plan, Samsung
is improving ``through silicon via’’ (TSV) memory stocking technology.
``Our long-term plan is clear. Using Samsung solutions for Samsung
products.’’
To prevent Qualcomm from losing
one of its top customers, it recently announced the launch of its
fifth-generation Gobi reference platform that seeks to pack support
nearly all major worldwide mobile standards into a single chip.
Based on the company’s Gobi LTE
wireless baseband modems, the MDM9615 and MDM9215 deliver fast LTE
connectivity with backwards compatibility to both HSPA+ and EV-DO
networks, Qualcomm insists.
``This will allow support for
regional LTE frequencies with backwards compatibility to existing 2G and
3G technologies, allowing Gobi LTE devices to connect to faster LTE
network locallys and stay connected to the Internet globally on 3G
networks worldwide,’’ it added.
Both Qualcomm officials in South
Korea, and Samsung Electronics spokesman Ken Noh declined to comment on
the Korean firm’s plans.
Samsung’s transition towards
becoming a solutions provider and a chip supplier is strengthening as
its mobile head Shin Jong-kyun is injecting more resources to expand the
management of its own telecom chips.
``Our division is not just to
produce smartphones and tablets. In order to diversify portfolios, our
division should do better for telecom chips,’’ said Shin.
The chip division is handling
mobile APs and the head of the company’s device solution unit, which
encompasses flat-screens and memory chips, recently told The Korea Times
that its mobile AP-making factory in Austin, Texas, became fully
operational last year. Apple’s i-devices use Samsung’s mobile APs
produced at the Austin plant.
The Exynos chip is currently
built using a 45-nanometer process but the new Exynos chip will be made
with 32-nanometer technology, giving better performance quality without
using as much power. Samsung said that in terms of performance, it gives
up to 26 percent more than the current 45-nanometer chip, with battery
life improved by half. The new version will be used in the Galaxy S III.
This in itself is good news for consumers who rely on battery performance when choosing devices.
``The development of quad-core
mobile APs is finalized and the decision to make one-chip solutions was
by Shin,’’ said an executive at the company’s semiconductor division.
``If Samsung successfully
strengthens its management for telecommunications chips, then it expects
to see more revenue from smartphones and tablets. That’s the scenario
we hope,’’ said the unnamed executive.
Samsung has a cross-licensing deal with Qualcomm until 2024 to use the American firm’s single-chip solutions.
Switzerland-based brokerage UBS
has raised its target for Samsung Electronics shares to 1.48 million won
citing a rising shares in smartphones.
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